RISKI ALDI PRATAMA; IDIAR IDIAR; SUBKHAN SUBKHAN. Analisis Simulasi Von Mises Punch dan Die pada Bending Dudukan Handphone. Mars: Jurnal Teknik Mesin, Industri, Elektro Dan Ilmu Komputer, [S. l.], v. 3, n. 5, p. 114–121, 2025. DOI: 10.61132/mars.v3i5.1109. Disponível em: https://journal.arteii.or.id/index.php/Mars/article/view/1109. Acesso em: 4 jun. 2026.